Vertiv has introduced new configurations of Vertiv MegaMod HDX, its prefabricated modular power and liquid cooling infrastructure solution designed for high-density computing environments, including artificial intelligence (AI) and high-performance computing (HPC) deployments. This modular infrastructure allows you to respond in an agile way to the new requirements imposed by advanced workloads.
The new configurations provide operators flexibility to support rapidly increasing power and cooling requirements, while optimizing space and deployment speed, two key benefits of modular infrastructure. The models are available worldwide and reinforce Vertiv’s commitment to prefabricated modular infrastructure solutions.
High density environments
Vertiv MegaMod HDX integrates direct-to-chip liquid cooling with air-cooled architectures to meet the intense thermal demands of AI workloads, supporting pod-type AI environments and advanced GPU clusters through a highly efficient modular infrastructure. The new compact solution has a standard module height and a maximum of 13 racks, with a power capacity of up to 1.25 MW; The combined solution features an extended height design and, with a maximum of 144 racks, supports power capacities of up to 10 MW, maintaining the scalable modular infrastructure approach.
Both configurations can support rack densities from 50 kW to over 100 kW per rack. Hybrid cooling architectures integrate direct-to-chip liquid cooling with air cooling for efficient, high-density thermal management, while prefabricated modular infrastructure designs enable rapid deployment and make it easy for customers to scale their data centers as demand grows.
“Today’s AI workloads demand cooling solutions that go beyond traditional approaches. With Vertiv MegaMod HDX available in both compact and combo solution configurations, organizations can match their facility requirements while supporting high-density environments at scale with liquid cooling. “Our modular infrastructure designs deliver what data centers need most: reliable operation, operational efficiency, and the ability to scale AI infrastructure with confidence,” said Viktor Petik, senior vice president of infrastructure solutions at Vertiv.
Vertiv MegaMod HDX models feature an innovative hybrid cooling architecture, combining direct-to-chip liquid cooling with adaptive air systems in a fully integrated prefabricated pod of modular infrastructure. The solutions incorporate a distributed redundant power architecture that enables continuous operation even if a module is out of service, an inherent advantage of modular infrastructure.
Additionally, the buffer tank thermal backup system enables GPU clusters to maintain stable operations during maintenance or load transitions. This factory-integrated, modular infrastructure design enables replicable precision in deployment, while providing cost certainty for AI infrastructure planning and scaling.
This prefabricated modular infrastructure design, combined with fully tested, factory-integrated components and Vertiv’s global services network, provides reliable end-to-end comprehensive support for critical environments.
Scalable rack architectures
Vertiv’s broad portfolio of power, thermal and IT management solutions supports a wide range of data center architectures, enabling customers to meet increasing density demands with a high-performance, scalable modular infrastructure. Both configurations are supported by this broader portfolio, which includes the Vertiv Liebert APM2 uninterruptible power supply (UPS), the Vertiv CoolChip CDU refrigerant distribution unit, the Vertiv™ PowerBar busbar system and the Vertiv™ Unify infrastructure monitoring solution, all of which can be integrated into a modular infrastructure approach.
Modular infrastructure designs deliver reliable performance, operational efficiency, and the ability to scale AI infrastructure with confidence
Vertiv also offers modular IT rack infrastructure designed to host and continuously support IT systems, including Vertiv and OCP-compatible racks, the Vertiv CoolLoop RDHx backdoor heat exchanger, the Vertiv CoolChip rack CDU, Vertiv rack power distribution units, the Vertiv PowerDirect rack DC power system, and the Vertiv CoolChip rack fluid network collectors.
